Discover our core embedded platforms engineered for critical process control, industrial automation, and rugged telemetry applications.
Hangzhou Fray Tech Co., Ltd. stands as a premier manufacturer and integrated solution provider specializing in advanced industrial computing, multi-layer circuit board layouts, and intelligent interactive display technologies. Driven by rigorous quality standards and application-specific innovations, we support industrial sectors through the delivery of high-reliability systems.
By integrating embedded software design, hardware optimization, and high-frequency circuit boards, Fray Tech constructs systems that serve as the technological backbone of global factories. From Fanless Industrial Panel PCs to edge SCADA modules, we ensure that digital transformation is supported by physical engineering.
In modern electronic design, the integrated circuit board (PCB/PCBA) is far more than a mounting medium; it is a critical element for electromagnetic integrity, thermal dissipation, and signal routing. In the realm of industrial computing, boards must support high-density interconnects (HDI) while maintaining reliable performance under thermal stress and mechanical shock. Our engineering teams integrate high-speed multi-layer layouts that optimize path lengths, reduce parasitic capacitance, and shield logic circuits from the electromagnetic fields typical of industrial environments.
This board-level integration underpins systems such as our Modbus TCP / MQTT telemetry controllers. By utilizing precise power layers, high-speed microcontrollers, and isolated analog-to-digital frontends, these modules convert legacy 4-20mA or 0-10V analog sensor feeds into clean IP packets. This bridge connects real-world physical dynamics directly with Manufacturing Execution Systems (MES) and Enterprise Resource Planning (ERP) databases, enabling low-latency data streams suitable for predictive maintenance models.
"The modern factory relies on physical-to-digital translation. A micro-volt drift on a sensor interface can halt an assembly line. Robust circuit design, component-level isolation, and targeted EMI shielding are essential for reliable smart manufacturing."
The global semiconductor and electronics market requires quick adaptions to supply disruptions, fluctuating silicon yields, and evolving international trade regulations. For system integrators and OEMs, consistency in the hardware lifecycle is a key commercial need. To mitigate risks, our supply chain structures emphasize component multisourcing, automated testing protocols, and robust design principles.
For instance, in our fanless configurations powered by processors like the Rockchip RK3588 or Intel Core series, we design motherboards to accept multiple power delivery profiles and standardized memory modules. This design approach ensures that changes in component availability do not require major system redesigns for our customers. As a result, partners in sectors like logistics, marine shipping, and petrochemical refining receive guaranteed product lifecycles of 5 to 7 years.
Operating in international markets requires strict compliance with localized safety and environmental directives. Every region presents specific regulatory requirements, from the European Union's CE and RoHS directives (restricting hazardous substances) to the Federal Communications Commission's (FCC) electromagnetic limits in North America.
A visual look into our production facilities, testing chambers, and assembly lines where quality control is maintained.
The performance of electronic components is shaped by their operating environments. Here are four common scenarios where our specialized industrial systems are deployed:
On marine vessels and offshore platforms, displays face intense challenges. Constant exposure to saltwater spray can corrode standard metals, and bright, direct sunlight can wash out typical screens. Our marine-grade 21.5-inch displays solve these issues with high-brightness (1000 nits) backlights and anti-reflective optical bonding. They remain readable in bright conditions and are sealed in heavy-duty IP67 enclosures to keep out water and salt.
Industrial edge computing requires local processing capacity to minimize dependency on cloud latency. Our versatile edge computing gateways (running Ubuntu 24.04 and featuring M.2 PCIe expansion) allow developers to compile and execute local machine learning models. By monitoring equipment vibrations, voltage patterns, or temperatures directly at the machine interface, these gateways trigger immediate preventative shutoffs when anomalies occur, protecting operations before they experience issues.
A stable thermal environment is essential in manufacturing plants. Water-cooled systems and cleanroom HVAC units must avoid mineral scale buildup, which can reduce cooling efficiency and cause thermal issues for internal PCBs.
Our 99% NaCl water softener salt tablets support these auxiliary cooling systems. By regenerating ion-exchange resins in industrial water softeners, they remove calcium and magnesium ions. This prevents scale accumulation in heat exchangers, keeping thermal control systems working efficiently and protecting sensitive microelectronics.
Interactive whiteboards and smart touchscreen tables require low-latency response and robust screen protection. In schools and training spaces, these displays need to withstand hours of daily touch interactions. Fray Tech's interactive displays use multi-point infrared or projective capacitive touch sensors, paired with tempered, anti-glare glass. This provides responsive touch and durability, ensuring long-term reliability in active learning environments.
Looking forward, the industrial computing landscape is evolving toward smarter, more autonomous architectures. Our research and development focuses on three primary technological areas:
1. Decarbonized Power Architectures & Thermal Efficiency: We are refining our board layouts to use GaN (Gallium Nitride) power conversion circuits. This design reduces internal heat generation by up to 35%, allowing for slimmer enclosures in fanless panel PCs.
2. Advanced Edge Intelligence (AIoT): We are integrating dedicated NPUs (Neural Processing Units) into our ARM platforms. This development allows gateways to process multiple real-time camera feeds and complex sensor streams locally, reducing data load on cloud infrastructure.
3. Multi-Protocol Unified Communication: Future versions of our edge gateways will support concurrent TSN (Time-Sensitive Networking) and OPC UA protocols, helping bridge the gap between high-speed machinery and legacy factory systems.
Clear answers to technical inquiries regarding integration, custom engineering, and environmental protections.
Discover our interactive flat displays, fanless workstation PCs, and custom controllers designed for high-use terminal applications.